In the realm of electronic devices, thirsting for ever-greater performance and efficiency, the semiconductor industry incessantly drives the frontiers of packaging technology. In the tapestry of interconnected dies within a package, effective signaling takes precedence. Bandwidth and power efficiency emerge as critical metrics determining the outcome of advanced semiconductor packaging efforts.
This article delves into the intricacies of material prerequisites, an essential foundation in the quest for heightened bandwidth - a vital ingredient in enhancing inter-die communication.