Microchip Technology (Nasdaq: MCHP) has unveiled an extensive range of SP1F and SP3F power modules equipped with Press-Fit terminals, catering to the demands of high-volume manufacturing in the E-Mobility, sustainability, and data center markets. These solder-free Press-Fit terminals facilitate automated or robotic installations, streamlining the assembly process and reducing manufacturing costs. The precise terminal placement and innovative Press-Fit pin design in the SP1F and SP3F power modules ensure reliable contact with the printed circuit card, contributing to high accuracy and efficiency.
With over 200 variants available, featuring options such as mSiC™ technology or Si semiconductors, diverse topologies, and ratings, the SP1F and SP3F power modules cover a voltage range of 600V-1700V and support currents up to 280A. Overall, the introduction of Press-Fit terminals in Microchip's power module portfolio offers a time-saving and cost-effective solution for high-volume applications.
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