Automatic High-precision Eutectic Die Bonding Machine
https://www.bozhontech.com/products/automatic-high-precision-eutectic-die-bonder/
#eutectic #die #bonder
Automatic High-precision Eutectic Die Bonding Machine
The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (12~50s/pcs) and high precision (0.5-3μm) . This series serves functions of eutectic bonding, dipping glue bonding and Flip Chip bonding. It is also able to meet the needs of mult... moreAutomatic High-precision Eutectic Die Bonding Machine
https://www.bozhontech.com/products/automatic-high-precision-eutectic-die-bonder/
#eutectic #die #bonder
Automatic High-precision Eutectic Die Bonding Machine
The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (12~50s/pcs) and high precision (0.5-3μm) . This series serves functions of eutectic bonding, dipping glue bonding and Flip Chip bonding. It is also able to meet the needs of multi-chip bonding. Its modular design enables the equipment to have highly flexible manufacturing capability. Also, equipped with an intelligent calibration and data management system, the MicroStar Series is capable to trace and manage process.
Parameters of Automatic High-precision Eutectic Die Bonding Machine
Patch efficiency 12~50s/pcs
Patch accuracy ±0.5~±3μm
Advantages of Automatic High-precision Eutectic Die Bonding Machine
Eutectic bonding, dipping glue bonding and Flip Chip bonding.
Meet the needs of multi-chip bonding
Advantages of Automatic High-precision Eutectic Die Bonding Machine
Its modular design enables the equipment to have highly flexible manufacturing capability
Advantages of Automatic High-precision Eutectic Die Bonding Machine
with an intelligent calibration and data management system, capable to trace and manage process.
